DK2.2 Arlon 880 HF PCB High Frequency Printed Circuit Board Fabrication
General Information:
Name:HF HIGH FREQUENCY PCB board
Dielectric constant:2.2(alternative material:TLY-5,RT5880,NY9220)
Material:Arlon 880 1.524mm
Layer:2
Surface finish:ENIG
Copper weight:1OZ
Finished board thickness:1.6mm
Type: PCB prototype
Board size:12*15cm
Quantity:15 pcs
Delivery time: 7 days
HF PCB Application:
• Military Radar Feed Networks
• Commercial Phased Array Networks
• Low Loss Base Station Antennas
• Missile Guidance Systems
• Digital Radio Antennas
• Filters, Couplers, LNAs
HF Material Selection:
| Brand | Model | Thickness(mm) | DK(ER) |
| Rogers | RO4003 | 0.203, 0.5,0.813,1.524 | 3.38 |
| RO4350 | 0.168,0.254 0.508,0.762,1.524 | 3.5 |
| RO4360G2 | 0.61,1.524 | 6.15 |
| RT5880 | 0.254.0.508.0.787 | 2.2 |
| RO3003 | 0.127,0.254,0.508,0.762,1.524 | 3 |
| RO3010 | 0.635 | 10.2 |
| RO3006 | 0.254 | 6.15 |
| RO3206 | 0.635MM | 10.2 |
| R03035 | 0.508MM | 3.5 |
| RT6010 | 0.635MM, 1,27MM | 10.2 |
| TACONIC | TLX-8.TLX-9 | 0.508. 0.762 | 2.45-2.65 |
| TLC-32 | 0.254,0.508,0.762 | 3.35 |
| TLY-5 | 0.254,0.508.0.8, | 2.2 |
| RF-60A | 0.254.0.508.0.762 | 6.15 |
| CER-10 | 0.254.0.508.0.762 | 10 |
| RF-30 | 0.254.0.508.0.762 | 3 |
| TLA-35 | 0.8 | 3.2 |
| ARLON | AD255C06099C | 1.5 | 2.55 |
| MCG0300CG | 0.8 | 3.7 |
| AD0300C | 0.8 | 3 |
| AD255C03099C | 0.8 | 2.55 |
| AD255C04099C | 1 | 2.55 |
| Diclad880 | 0.762,1.524mm | 2.2 |
| DLC220 | 1 | 2.2 |
| F4B | F4B | 0.38 | 2.2 |
| F4B | 0.55 | 2.23 |
| F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 |
| F4Bk | 0.8,1.5 | 2.65 |
| F4B | 0.8 | 3.5 |
| FE=F4BM | 1 | 2.2 |
The basic characteristics of high-frequency PCB substrate materials:
1, the dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transmission rate and the material is inversely proportional to the square root of the dielectric constant, high dielectric constant susceptible to signal transmission delay.
2,Dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller the dielectric loss so that the signal loss is also smaller.
3,And in accordance with copper foil thermal expansion coefficient as far as possible, because inconsistencies in the change in the cold and heat caused by copper foil separation.
4,Water absorption is low, high water absorption will affect the dielectric constant when the damp and dielectric loss.
5,Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.
High frequency PCB description:
High-frequency PCB (Printed Circuit Board) refers to a type of PCB that is designed to handle high-frequency signals, typically in the radio frequency (RF) and microwave ranges. These PCBs are engineered to minimize signal loss, maintain signal integrity, and control impedance at high frequencies.
Here are some key considerations and features of high-frequency PCBs:
Material Selection: High-frequency PCBs often use specialized materials with low dielectric constant (Dk) and low dissipation factor (Df). Common materials include PTFE (Polytetrafluoroethylene), FR-4 with enhanced properties, and specialized laminates like Rogers or Taconic.
Controlled Impedance: Maintaining consistent impedance is crucial for high-frequency signals. High-frequency PCBs employ controlled impedance routing, which involves precise trace widths, spacing, and dielectric thickness to achieve the desired characteristic impedance.
Signal Integrity: High-frequency signals are susceptible to noise, reflections, and losses. PCB design techniques such as proper ground plane placement, signal return paths, and controlled crosstalk are employed to minimize signal degradation and maintain signal integrity.
Transmission Lines: High-frequency PCBs often incorporate transmission lines, such as microstrip or stripline, to carry the high-frequency signals. These transmission lines have specific geometries to control impedance and minimize signal loss.
Via Design: Vias can impact signal integrity at high frequencies. High-frequency PCBs may use techniques like back drilling or buried vias to minimize signal reflections and maintain signal integrity across layers.
Component Placement: Careful consideration is given to component placement to minimize signal path lengths, reduce parasitic capacitance and inductance, and optimize signal flow.
Shielding: To minimize electromagnetic interference (EMI) and RF leakage, high-frequency PCBs may employ shielding techniques such as copper pours, ground planes, or metal shielding cans.
High-frequency PCBs find applications in various industries, including wireless communication systems, aerospace, radar systems, satellite communication, medical devices, and high-speed data transmission.
Designing and manufacturing high-frequency PCBs require specialized skills, knowledge, and simulation tools to ensure the desired performance at high frequencies. It is often recommended to work with experienced PCB designers and manufacturers who specialize in high-frequency applications.
